Qingqing Wang, Yun Zheng, Chonghao Zhai, Xudong Li, Qihuang Gong, Jianwei Wang. Chip-based quantum communications[J]. Journal of Semiconductors, 2021, 42(9): 091901. doi: 10.1088/1674-4926/42/9/091901.
Q Q Wang, Y Zheng, C H Zhai, X D Li, Q H Gong, J W Wang, Chip-based quantum communications[J]. J. Semicond., 2021, 42(9): 091901. doi: 10.1088/1674-4926/42/9/091901.
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Along with NOR flash cell scaling down, dielectric burnout has gradually become one of the most important factors which affects product reliability, especially for high dropout voltage films. In this study, we demonstrate a reliability-enhanced NOR flash cell in 50 nm node technology through structural optimization of floating gate (FG) dimensions and active area profile. By synergistically increasing FG thickness, reducing FG width, and tuning cell-open depth, the control gate-to-active area corner distance expands by 22%, suppressing peak electric fields by 29% vertically and 18% horizontally. This structural innovation achieves: (1) 100× reduction in early-cycle burnout failures, (2) 7.38× Time Dependent Dielectric Breakdown lifetime improvement, while maintaining data retention and accelerating programming/erasing speeds by 15.4%/7.3%. The enhanced reliability enables 97.5% reduction in Fowler-Nordheim stress time during Characterization Program testing, providing a cost-effective solution for automotive-grade flash memories.